Industry Session

Abstract
Advanced packaging is now central to semiconductor manufacturing for mobile, AI, and server devices, where tight process control requires accurate metrology of wafer/die warpage and fine structures such as redistribution layers (RDLs) and through-silicon vias (TSVs). This study investigates integrated optical measurement approaches for these requirements.
Wafer warpage is evaluated using deflectometry and Moiré methods, enabling rapid, non-contact inspection of 300 mm wafers with high throughput and high accuracy. Die warpage is assessed via real-time optical interferometry, providing high sensitivity to subtle shape variations and immediate feedback for process optimization.
For structural metrology of RDLs and TSVs, white-light interferometry (WLI) and spectral interferometry are employed. WLI delivers detailed three-dimensional surface topography for morphological characterization, while spectral interferometry provides precise depth information through spectral analysis. The combined methods demonstrate robust performance across both smooth substrates (e.g., silicon and glass) and rough surfaces (e.g., molded packages), addressing the diverse material and surface conditions encountered in advanced packaging.
Overall, the results show that combining deflectometry, Moiré, real-time interferometry, and spectral techniques supports reliable in-line metrology and enhances process control for next-generation semiconductor packaging.

Abstract
Advanced manufacturing requires both large-area process monitoring and high-precision local measurements under complex and high-speed production conditions. In semiconductor, display, and battery manufacturing, small variations in thickness, surface profile, and defect distribution directly affect device performance, yield, and long-term reliability. As production speeds increase and device structures become more complex, metrology systems must provide not only high spatial resolution but also stable and repeatable performance during in-line operation. To address these multi-scale challenges, we present an optical metrology framework that combines AI-based vision for wide-area inspection with spectral-domain interferometry for point-based nanometer-scale measurement. The framework is demonstrated through laser-based cutting of large glass substrates used in display manufacturing, where high-speed in-line processing can generate micro-cracks as well as local thickness and refractive index variations caused by thermal and mechanical effects. The AI vision system enables fast crack detection and spatial analysis over large moving substrates without interrupting production, while spectral-domain interferometry provides non-contact thickness and refractive index measurement at selected points for detailed analysis. Although the two systems operate independently according to process needs, their architectures are developed under an international traceability system based on the Guide to the Expression of Uncertainty in Measurement (GUM) to ensure reliable and consistent measurement results across different production runs and sites. By combining large-area inspection and precise point-based measurement within a unified reliability-focused framework, the proposed approach provides a practical solution applicable not only to glass processing but also to semiconductor wafer and battery manufacturing.

Abstract
JS Precision, established in 2013, is the only specialized manufacturer of ultra-precision machine tools with proprietary hydrostatic guideway technology in Korea. JS Precision produces a wide range of ultra-precision equipment including RDM (Roll Die Machine), LSM (Large Surface Machine), and DTM (Diamond Turning Machine), as well as hydrostatic guideway units and related components. This session aims to introduce the machines manufactured by JS Precision and to present the various fields in which ultra-precision patterns and geometries machined using these systems are being applied.

Abstract
This study presents a total in-house solution for the fabrication of high-performance Polycrystalline Diamond (PCD) micro-drills, covering everything from system design to final tool production. Unlike traditional grinding methods that face physical constraints in micro-scale machining, our approach utilizes an advanced multi-axis laser system developed entirely in-house. By integrating ultra-short pulse laser technology with a 5-axis mechanical structure, we have successfully overcome the limitations of conventional tool geometry, enabling more complex and diverse designs.